การเติบโตของบรรจุภัณฑ์ชิปขั้นสูงของ ASE

PARAGRAPH 1 --- ASE Technology Holding Co., Ltd. (NYSE:ASX), a leading semiconductor packaging and testing provider, has seen a surge in bullish sentiment due to its advancements in advanced chip packaging. On May 26, 2026, ASE announced the development of an automated 310mm x 310mm panel-level packaging production line, expected to enter production in early 2027. This is the first of its kind in the industry. Additionally, BofA lifted its price target on ASX to $48 from $36 on June 24, reaffirming a Buy rating, citing the company's strong growth prospects.

PARAGRAPH 2 --- The market impact of these developments is significant. The global semiconductor packaging market is projected to grow at a CAGR of 5.5% from 2021 to 2028, driven by increasing demand for advanced packaging technologies. ASE's advancements position it well to capture a larger share of this growing market. The company's peers, such as BE Semiconductor Industries (OTC:BESIY), are also benefiting from this trend, with BESIY raising its long-term revenue target due to increased demand for high-bandwidth memory. Meanwhile, investors are bullish on ASX, with analysts naming it one of the best long-term growth stocks and one of the most promising stocks to buy right now.

PARAGRAPH 3 --- What to watch next: ASE's revenue growth in its advanced packaging business is a key metric to monitor. The company expects this segment to rise 10% to more than $3.5 billion in 2026. Additionally, the successful development and launch of the automated panel-level packaging production line in 2027 will be a significant catalyst for the company. Lastly, investors will be watching ASE's earnings releases, with the next one scheduled for late October 2026, to gauge the company's progress and growth prospects.